The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Apr. 28, 2004
Lassi Hyvönen, Helsinki, FI;
Miikka Hämäläinen, Espoo, FI;
Lassi Hyvönen, Helsinki, FI;
Miikka Hämäläinen, Espoo, FI;
Nokia Corporation, Espoo, FI;
Abstract
A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of which has a dielectric core layer between two electrically conductive foils. One of the layers has one or more openings for securing the embedded RF-chips with a bonding material such as epoxy. The electrically conductive foils on the inner layers can be etched or otherwise removed to form electrical circuits. Micro-vias can be provided through the various layers for interconnecting the electrical circuits and the RF-chips. The electrically conductive foils on the outer layers of the laminated structure can be used to provide electromagnetic shielding to the RF-chips.