The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Sep. 18, 2003
Todd H. Buley, Stone Ridge, NY (US);
Brian Chapman, Poughkeepsie, NY (US);
Roger Lam, Fishkill, NY (US);
Wai Mon MA, Poughkeepsie, NY (US);
John P. Weir, Lagrangeville, NY (US);
Todd H. Buley, Stone Ridge, NY (US);
Brian Chapman, Poughkeepsie, NY (US);
Roger Lam, Fishkill, NY (US);
Wai Mon Ma, Poughkeepsie, NY (US);
John P. Weir, Lagrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.