The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2005

Filed:

Feb. 04, 2002
Applicants:

Hirofumi Horiuchi, Tokyo, JP;

Ryoichi Hoshino, Tokyo, JP;

Noboru Ogasawara, Tokyo, JP;

Takashi Tamura, Tokyo, JP;

Takashi Terada, Tokyo, JP;

Futoshi Watanabe, Tokyo, JP;

Inventors:

Hirofumi Horiuchi, Tokyo, JP;

Ryoichi Hoshino, Tokyo, JP;

Noboru Ogasawara, Tokyo, JP;

Takashi Tamura, Tokyo, JP;

Takashi Terada, Tokyo, JP;

Futoshi Watanabe, Tokyo, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F25B041/00 ; F25B039/04 ; F25B039/02 ; F28B001/00 ; F28D007/10 ;
U.S. Cl.
CPC ...
Abstract

This duplex-type heat exchanger is adapted to a vapor compression type refrigeration cycle in which a condensed refrigerant is decompressed and then evaporated. This duplex-type heat exchanger is integrally equipped with a subcooler S in which the condensed refrigerant exchanges heat with the ambient air A to be subcooled and an evaporator E in which the decompressed refrigerant exchanges heat with the ambient air A to be evaporated. Heat exchange is performed between the refrigerant passing through the subcooler S and the refrigerant passing through the evaporator E, to thereby cool the refrigerant in the subcooler S and heat the refrigerant in the evaporator E. Accordingly, according to this heat exchanger, a high refrigeration effect can be obtained while avoiding the pressure rise of the refrigerant.


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