The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Jan. 15, 2004
Timothy John Havens, Florence, SC (US);
Michael Sellers, Florence, SC (US);
Delton Grey, Florence, SC (US);
Timothy John Havens, Florence, SC (US);
Michael Sellers, Florence, SC (US);
Delton Grey, Florence, SC (US);
GE Medical Systems Global Technology Company, LLC, Waukesha, WI (US);
Abstract
The disclosed apparatus relates to a gradient coil assembly for a magnetic resonance imaging system. The gradient coil assembly comprises: at least two coils. The coils comprise: at least one conductor mechanically bonded via a nonconducting substrate. The bonding surface of the at least one conductor has been subjected to a surface treatment to improve the mechanical bonding properties of the bonding surface. The disclosed apparatus also relates to a magnetic imaging system. The magnetic imaging system comprises: a system controller; a gradient amplifier unit in operable communication with the system controller; a magnetic assembly in operable communication with the gradient amplifier. The magnetic assembly comprises: a gradient coil assembly comprising at least two coils. The coils comprise: at least one conductor mechanically bonded via a nonconducting substrate. A bonding surface of the at least one conductor has been subjected to a surface treatment to improve the mechanical bonding properties of the bonding surface. The disclosed method relates to assembling a gradient coil assembly. The method comprises: treating a bonding surface of at least one conductor; and bonding the at least one conductor to a nonconducting substrate.