The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Jan. 25, 2002
Yoshiharu Kato, Kasugai, JP;
Satoru Kawamoto, Kasugai, JP;
Fumihiko Taniguchi, Kawasaki, JP;
Tetsuya Hiraoka, Kawasaki, JP;
Akira Takashima, Kawasaki, JP;
Yoshiharu Kato, Kasugai, JP;
Satoru Kawamoto, Kasugai, JP;
Fumihiko Taniguchi, Kawasaki, JP;
Tetsuya Hiraoka, Kawasaki, JP;
Akira Takashima, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second Semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.