The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Dec. 11, 2003
Yusuke Igarashi, Gunma, JP;
Nobuhisa Takakusaki, Gunma, JP;
Jun Sakano, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Yusuke Igarashi, Gunma, JP;
Nobuhisa Takakusaki, Gunma, JP;
Jun Sakano, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
To make thin a circuit devicein which are incorporated a plurality of types of circuit elementsthat differ in thickness, first conductive patterns, onto which comparatively thin circuit elementsA are mounted, are formed thickly, and second conductive patternsB, onto which comparatively thick second circuit elementsB are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patternsB. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patternsB, the total thickness can be made thin. Thinning of circuit deviceas a whole can thus be accomplished.