The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Jul. 24, 2003
James A. Zollo, Weston, FL (US);
Nitin B. Desai, Coral Springs, FL (US);
James A. Zollo, Weston, FL (US);
Nitin B. Desai, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A multilayer circuit board () includes a plurality of substrate cores (and), an adhesive/bonding layer () between at least two among the plurality of substrate cores, and a microvia (and) in each of at least two of the plurality of substrate cores. The microvia includes a conductive interconnection () between a top conductive surface and a bottom conductive surface of each of the plurality of substrate cores and the microvia in a first substrate core is arranged to be inverted relative to a microvia in a second substrate core. The multilayer circuit board can further include a plated through-hole () through the plurality of substrate cores and the adhesive/bonding layer such that at least two among the top conductive surfaces (or) and the bottom conductive surfaces (or) of the plurality of substrate cores are connected.