The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Aug. 20, 2003
Yoshitaro Yazaki, Anjo, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Koji Kondo, Toyohashi, JP;
Toshikazu Harada, Kariya, JP;
Tomohiro Yokochi, Obu, JP;
Yoshitaro Yazaki, Anjo, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Koji Kondo, Toyohashi, JP;
Toshikazu Harada, Kariya, JP;
Tomohiro Yokochi, Obu, JP;
Denso Corporation, Kariya, JP;
Abstract
A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.