The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2005
Filed:
Sep. 05, 2003
Akira Chinda, Tokyo, JP;
Akira Chinda, Tokyo, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A semiconductor device has: a wiring board that includes an insulating substrate and a wiring provided on the insulating substrate; a semiconductor chip that is mounted on the wiring board; an opening that is formed at a predetermined position in the insulating substrate, one end of the opening being shut by the wiring to form the bottom of the opening; a thin film conductor that is formed on the surface of the wiring and at the bottom of the opening; an embedded conductor layer that is provided in the opening while contacting the thin film conductor formed at the bottom of the opening; and an external connection terminal that is disposed at the other end of the opening to electrically connect with the wiring through the embedded conductor layer and the thin film conductor provided in the opening. The thin film conductor includes gold plating layer formed on the surface, the external connection terminal is of tin or an alloy including tin, and the embedded conductor layer is of a conductor that has a rate of solution to tin or an alloy including tin lower than that of gold.