The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2005
Filed:
Jul. 19, 2001
Joyce S. Obey Hewett, Austin, TX (US);
Alexander James Pasadyn, Austin, TX (US);
Joyce S. Obey Hewett, Austin, TX (US);
Alexander James Pasadyn, Austin, TX (US);
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether the measured thickness of the conductive layer is within a predetermined tolerance, and revising the deposition recipe if the thickness of the conductive layer is not within the predetermined tolerance. An apparatus includes a deposition unit capable of depositing a conductive layer according to a deposition recipe; a thickness measuring unit capable of measuring at least one thickness of the conductive layer and outputting thickness data; and a deposition control unit capable of receiving the thickness data from the thickness measuring unit, determining whether the thickness data is within a predetermined tolerance, revising the deposition recipe if the thickness data is not within the predetermined tolerance, and outputting the revised deposition recipe.