Method of fabricating a semiconductor device that includes removing a residual conducting layer from a sidewall spacer corresponding to a gate electrode of a flash memory

Abstract

Methods of fabricating semiconductor devices are disclosed. An example method may include providing a substrate including an active region and a non-active region and forming a first gate electrode comprising a dielectric layer pattern, a first conducting layer pattern, and a first insulating layer pattern, the first gate electrode functioning as a flash memory. The example method may also include forming spacers on sidewalls of the first gate electrode; forming a second gate electrode comprising a gate oxide, a second conducting layer pattern, and a second insulating layer pattern, the second gate electrode functioning as a normal gate electrode; and removing a residual conducting layer on one sidewall of the spacer.