The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2005
Filed:
Dec. 13, 2002
Takeo Eguchi, Kanagawa, JP;
Masayuki Takakura, Kanagawa, JP;
Masato Nakamura, Kanagawa, JP;
Shinichi Horii, Kanagawa, JP;
Hiroyasu Uchida, Kanagawa, JP;
Akihito Miyazaki, Kanagawa, JP;
Takeo Eguchi, Kanagawa, JP;
Masayuki Takakura, Kanagawa, JP;
Masato Nakamura, Kanagawa, JP;
Shinichi Horii, Kanagawa, JP;
Hiroyasu Uchida, Kanagawa, JP;
Akihito Miyazaki, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A print head for a line printer in which errors between print head chips and another component are reduced and ink leakage is prevented, and in which heat generated in print head chips is efficiently dissipated without making the structure of the print head complex or increasing the size of the print head. A plurality of print head chips () are arranged along an ink path () and are disposed on both sides of the ink path in a zigzag pattern. Dummy chips () which do not eject ink are disposed at regions between the print head chips () arranged along the ink path (). In addition, an ink-path member () is provided, at least a part of the ink-path member () which includes portions adhered to the print head chips () being composed of a material having a high thermal conductivity, so that the ink-path member () also serves as heat-dissipating means which dissipates heat generated in the print head chips ().