The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
May. 23, 2003
Applicants:
Yoshitaka Aiba, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Inventors:
Yoshitaka Aiba, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device including a semiconductor element having an electrode pad, a mounting terminal for mounting a substrate, an adhesive layer provided on the semiconductor element, and a wiring electrically connecting the electrode pad to the mounting terminal. The wiring includes a metal foil and a metal film layer. The entire metal foil is in contact with the adhesive layer, and the metal film layer is in contact with the electrode pad.