The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Oct. 15, 2003
Phillip L. Jordan, Sultan, WA (US);
John P. Yarno, Snohomish, WA (US);
Jeffery A. Strole, Ellensburg, WA (US);
Mikhail P. Bak, Seattle, WA (US);
Joseph R. Ketterl, Seattle, WA (US);
Phillip L. Jordan, Sultan, WA (US);
John P. Yarno, Snohomish, WA (US);
Jeffery A. Strole, Ellensburg, WA (US);
Mikhail P. Bak, Seattle, WA (US);
Joseph R. Ketterl, Seattle, WA (US);
MicroConnex Corp., Snoqualmie, WA (US);
Abstract
A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.