The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Feb. 20, 2003
Applicants:
Kee Yean NG, Penang, MY;
Keh Chin Seah, Penang, MY;
Chong Hai Lee, Penang, MY;
Inventors:
Assignee:
Agilent Technologies, Inc., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.
Ng, Kee. (2005). Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method (U.S. Patent No. 6967123). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6967123
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile