The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Feb. 11, 2004
Applicants:
Kuo-yu Tang, Hsin Chu, TW;
Jung-hong Huang, Ta Li, TW;
Lei-yi Chen, Chu Tung Jen, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsinchu Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B049/00 ;
U.S. Cl.
CPC ...
Abstract
A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary worktable module, air pressure spindle module and an adjustment module.