The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Feb. 27, 2002
Masahide Tokuda, Ome, JP;
Kimio Tatsuno, Tokyo, JP;
Hirohisa Sano, Niiza, JP;
Takeshi Shimano, Tokorozawa, JP;
Shigeharu Kimura, Tokyo, JP;
Masahide Tokuda, Ome, JP;
Kimio Tatsuno, Tokyo, JP;
Hirohisa Sano, Niiza, JP;
Takeshi Shimano, Tokorozawa, JP;
Shigeharu Kimura, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Nichia Corporation, Tokushima, JP;
Abstract
A method of mounting an optical device having a step on the surface opposing to a mounting substrate favorably by face-down bonding which enables a decrease in the number of components or integrate additional components on one identical substrate and, accordingly, is useful for reducing the size and the thickness of an optical head using a light source, the method includes the step of making the volume of a solder pattern to the area ratio of each electrode different for every wiring electrode portions upon mounting the electrodes on the substrate for mounting the optical device, in which the optical device having the step can be mounted favorably to the substrate by the control for the height of solder upon melting.