The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Apr. 23, 2003
Yiduo Zhang, Plymouth, MN (US);
Raymond R. Wolter, Hutchinson, MN (US);
Craig A. Leabch, Saint Cloud, MN (US);
Yiduo Zhang, Plymouth, MN (US);
Raymond R. Wolter, Hutchinson, MN (US);
Craig A. Leabch, Saint Cloud, MN (US);
Hutchinson Technology Incorporated, Hutchinson, MN (US);
Abstract
A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.