The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2005

Filed:

Feb. 26, 2002
Applicant:

Jason Barnabas Langhorn, South Bend, IN (US);

Inventor:

Jason Barnabas Langhorn, South Bend, IN (US);

Assignee:

CTS Corporation, Elkhart, IN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is located adjacent to the top surface. Vias extend through the substrate between the surfaces. The micro-machined semiconductor device is electrically connected to the vias. A rigid support is located between the micro-machined semiconductor device and the top surface to support the micro-machined semiconductor device during assembly and to space the micro-machined semiconductor device from the top surface. Solder spheres are mounted to the bottom surface and are connected to the vias.


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