The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Oct. 05, 2000
Applicants:
Seinosuke Mizuno, Tokyo, JP;
Yoshiyuki Nishi, Chiba-ken, JP;
Yasunari Ashida, Mie-ken, JP;
Tatsumi Hirano, Mie-ken, JP;
Inventors:
Seinosuke Mizuno, Tokyo, JP;
Yoshiyuki Nishi, Chiba-ken, JP;
Yasunari Ashida, Mie-ken, JP;
Tatsumi Hirano, Mie-ken, JP;
Assignees:
Nippon Ply Co., Ltd., Tokyo, JP;
Showa Electric Wire & Cable Co., Ltd., Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D022/00 ;
U.S. Cl.
CPC ...
Abstract
A shrinkage control material for elastomeric molding. On a surface of a resilient metal wire, an adhesive layer of a halogenated polymer-based or olefin-based adhesive is disposed. An elastomeric molding includes the shrinkage control material and a elastomeric extrusion formed around the shrinkage control material to cover, the elastomeric extrusion being bonded by vulcanization to the shrinkage control material.