The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Mar. 29, 2001
Atsushi Miyazaki, Tokyo, JP;
Katsuhiko Kikuchi, Hitachinaka, JP;
Masaaki Suzuki, Hitachinaka, JP;
Ryozo Tomosaki, Tokyo, JP;
Atsushi Miyazaki, Tokyo, JP;
Katsuhiko Kikuchi, Hitachinaka, JP;
Masaaki Suzuki, Hitachinaka, JP;
Ryozo Tomosaki, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit () is molded with resin and includes a semiconductor chip () for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member () has one end exposed in a connector () and is electrically connected to the semiconductor chip () in the sensor unit () beforehand. Pressure is applied to the semiconductor chip () through a pipe (). An outer case () is integrally formed of synthetic resin by insert molding of the sensor unit (), the lead member () and the pipe ().