The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2005

Filed:

Feb. 27, 2003
Applicants:

Hirosuke Mikami, Osaka, JP;

Hirokazu Uchiyama, Osaka, JP;

Hideki Kuwajima, Kyoto, JP;

Inventors:

Hirosuke Mikami, Osaka, JP;

Hirokazu Uchiyama, Osaka, JP;

Hideki Kuwajima, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R017/00 ; C23F001/00 ;
U.S. Cl.
CPC ...
Abstract

A method comprises: bonding a plurality of thin film piezoelectric elements, formed on a substrate, onto a temporary fixing substrate via an adhesive layer; selectively removing the substrate to expose the thin film piezoelectric elements; fixing an element housing jig having sectional regions for individually isolating the thin film piezoelectric elements in such manner that the thin film piezoelectric elements and the sectional regions correspond to each other; and dissolving and removing the adhesive layer, and housing the thin film piezoelectric elements in the sectional regions of the element housing jig. Accordingly, it is possible to individually isolate and house the thin film piezoelectric elements removed from the substrate.


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