The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Apr. 07, 2003
Applicants:
Hajime Arai, Aiko-gun, JP;
Ikuo Someya, Sagamihara, JP;
Inventors:
Hajime Arai, Aiko-gun, JP;
Ikuo Someya, Sagamihara, JP;
Assignee:
NHK Spring Co., Ltd., Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
G11B005/48 ; G11B005/58 ;
U.S. Cl.
CPC ...
Abstract
A wired flexure comprises a metallic substrate, a polyimide layer formed on the metallic substrate, and read conductors and write conductors formed on the polyimide layer. The polyimide layer has a thick-walled portion and a thin-walled portion that are different in thickness. The read and write conductors extend covering the thick- and thin-walled portions. In order to obtain a desired impedance, the width of the conductors in the thin-walled portion is smaller than that of the conductors in the thick-walled portion.