The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
May. 02, 2003
Toru Nagase, Tokyo, JP;
Minoru Tajima, Tokyo, JP;
Nobuhiro Tokumori, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.