The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Apr. 24, 2003
Hideyuki Usui, Osaka, JP;
Satoshi Okuda, Osaka, JP;
Minoru Nakao, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile