The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Dec. 27, 2002
Ming-yueh Liu, Taipei, TW;
Heng-chun Huang, MiaoLi, TW;
Jauh-jung Yang, Taipei, TW;
Kun-chih Pan, TaiChung, TW;
Ming-Yueh Liu, Taipei, TW;
Heng-Chun Huang, MiaoLi, TW;
Jauh-Jung Yang, Taipei, TW;
Kun-Chih Pan, TaiChung, TW;
Industrial Technology Research Inst., Hsinchu, TW;
Abstract
A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.