The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Sep. 14, 2001
Applicants:
Yoshimi Uda, Kanagawa, JP;
Kazuya Ishiwata, Kanagawa, JP;
Shinsaku Kubo, Kanagawa, JP;
Yasuyuki Watanabe, Tokyo, JP;
Inventors:
Yoshimi Uda, Kanagawa, JP;
Kazuya Ishiwata, Kanagawa, JP;
Shinsaku Kubo, Kanagawa, JP;
Yasuyuki Watanabe, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F007/20 ; G03F007/16 ; G03F007/22 ; G03F007/26 ; G03F007/40 ;
U.S. Cl.
CPC ...
Abstract
In a method of manufacturing an electroconductive film, a developing process is implemented on a photosensitive paste layer () having a height of about 13 μm in a state where exposure is repeated twice in FIG.D, and thereafter, a baking process is completed to form a wiring pattern (). As a result, the curling of an edge formed in the wiring pattern () can be remarkably reduced.