The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Sep. 26, 2002
Kevin T. Knadle, Endicott, NY (US);
Anita Sargent, Endicott, NY (US);
Kevin T. Knadle, Endicott, NY (US);
Anita Sargent, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile