The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2005

Filed:

Jul. 31, 2003
Applicants:

Hiroshi Moriya, Chiyoda-machi, JP;

Kisho Ashida, Chiyoda-machi, JP;

Yoshiaki Niwa, Yokohama, JP;

Inventors:

Hiroshi Moriya, Chiyoda-machi, JP;

Kisho Ashida, Chiyoda-machi, JP;

Yoshiaki Niwa, Yokohama, JP;

Assignee:

OpNext Japan, Inc., Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S003/04 ; H01S005/00 ;
U.S. Cl.
CPC ...
Abstract

In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W≧0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.


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