The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Mar. 28, 2003
Applicant:
Jürgen Högerl, Regensburg, DE;
Inventor:
Jürgen Högerl, Regensburg, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor wafer is produced with an outer contact layer applied to the entire surface of an insulating layer and a rewiring layer embedded therein. At the same time, fuses are short-circuited. After the outer contact layer has been patterned and a passivation layer has been applied, outer contacts and short-circuit lines are uncovered. Outer contacts are introduced into passage openings in the passivation layer. The semiconductor structures are tested and predetermined short-circuit lines are interrupted. Then, the semiconductor wafer is diced into semiconductor chips.