The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2005

Filed:

Dec. 12, 2000
Applicants:

Takumi Mikawa, Kyoto, JP;

Yuji Judai, Kyoto, JP;

Inventors:

Takumi Mikawa, Kyoto, JP;

Yuji Judai, Kyoto, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L029/76 ; H01L027/108 ; H01L029/00 ; H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract

A lower electrode is formed on a substrate, a capacitive insulating film is formed out of a ferroelectric film on the lower electrode, and an upper electrode is formed on the capacitive insulating film. A contact layer is formed on the upper electrode. The contact layer is either a single-layer film made of a metal oxide or a metal nitride or a multilayer structure made up of metal oxide and metal nitride films. An insulating film is formed to cover the lower electrode, capacitive insulating film, upper electrode and contact layer. A contact hole is opened through the insulating film and the contact layer to reach the upper electrode. A metal interconnect, which is filled in the contact hole and connected to the upper electrode, is formed on a part of the insulating film.


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