The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6960420 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 01, 2005

Filed:

Nov. 06, 2003
Applicant:

Hiroshi Komatsu, Ibaraki, JP;

Inventor:

Hiroshi Komatsu, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F007/004 ;
U.S. Cl.
CPC ...
Abstract

A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1):(where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.


Find Patent Forward Citations

Komatsu, Hiroshi. (2005). Photosensitive resin composition, process for forming relief pattern, and electronic component (U.S. Patent No. 6960420). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6960420

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