The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2005

Filed:

Feb. 05, 2003
Applicants:

Hitoshi Heta, Toyota, JP;

Tamotsu Nagaya, Toyota, JP;

Toshiaki Kondo, Okazaki, JP;

Masahiko Uchida, Okazaki, JP;

Makoto Suzuki, Okazaki, JP;

Inventors:

Hitoshi Heta, Toyota, JP;

Tamotsu Nagaya, Toyota, JP;

Toshiaki Kondo, Okazaki, JP;

Masahiko Uchida, Okazaki, JP;

Makoto Suzuki, Okazaki, JP;

Assignee:

Araco Kabushiki Kaisha, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B003/24 ; F16B005/08 ;
U.S. Cl.
CPC ...
Abstract

Combined boards are taught that comprise a second board substrate () having a through bore () formed therein, a first board substrate (), and a connector pin () received in the through bore () of the second board substrate (). The first and second board substrates overlap such that the through bore () of the second board substrate () is covered by a first surface () of the first board substrate (). The connector pin is fusion bonded to a circumferential surface of the through bore () and the first surface () of the first board substrate ().


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