The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Aug. 10, 2001
Bettina Becker, Monheim, DE;
Angela Rossini, I-Mailand, IT;
Thomas Moeller, Duesseldorf, DE;
Thomas Huver, Duesseldorf, DE;
Georg Schubert, Moenchengladbach, DE;
Bettina Becker, Monheim, DE;
Angela Rossini, I-Mailand, IT;
Thomas Moeller, Duesseldorf, DE;
Thomas Huver, Duesseldorf, DE;
Georg Schubert, Moenchengladbach, DE;
Henkel Kommanditgesellschaft auf Aktien, Duesseldorf, DE;
Abstract
Polyamides based on reaction products of C-Cdicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.