The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Oct. 10, 2003
Yukihiro Isa, Tateyama, JP;
Yukihiro Isa, Tateyama, JP;
UMC Japan, Chiba Ken, JP;
Abstract
The bump ball crimping apparatus of the present invention is characterized in comprising an alignment platefor aligning bump balls; a crimping tableon which the wafer to which bump balls are to be crimped is mounted; a crimping platethat crimps the bump balls onto the bonding pads of the wafer; a Y-axis moving mechanismthat can move the alignment platein the Y direction and can fasten it at a predetermined position; an X-axis moving mechanism that can move the alignment platein the X direction and can fasten it at a predetermined position; and a second Y-axis moving mechanismthat can move the crimping tablein the Y direction and can fasten it at a predetermined position.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile