The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2005
Filed:
Oct. 14, 2003
Yoshiaki Nakayama, Okazaki, JP;
Yoshiaki Nakayama, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
Semiconductor equipment includes a semiconductor substrate, a plurality of first type semiconductor devices having first and second device regions, a plurality of second type semiconductor devices having the first and second device regions, and upper and lower layer wirings disposed on the substrate. The upper and lower layer wirings electrically connect a plurality of first and second device regions together with a parallel connection, respectively. The lower layer wiring includes a first contact for connecting to the first device region and a second contact for connecting to the second device region. The first contact is concentrated into a predetermined area. The second contact surrounds the first contact. The upper layer wiring disposed on the predetermined area provides a pad area for connecting to an external circuit.