The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2005

Filed:

Jan. 12, 2004
Applicants:

Junichi Ueno, Otsu, JP;

Michiharu Torii, Moriyama, JP;

Takayuki Tanaka, Osaka, JP;

Inventors:

Junichi Ueno, Otsu, JP;

Michiharu Torii, Moriyama, JP;

Takayuki Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and a semiconductor chip mounted on the film substrate. In this semiconductor device, the film substrate is folded so that at least one edge of the film substrate is on a side opposite to a side on which the semiconductor chip is mounted, and portions of the wiring electrodes exposed from the covering member on a surface of the film substrate on which the semiconductor chip is mounted are to be connected to electrodes of an external electronic device.


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