The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Apr. 24, 2003
Masahiko Mizutani, Ota, JP;
Sadamichi Takakusaki, Ota, JP;
Motoichi Nezu, Ora-gun, JP;
Kazutoshi Motegi, Ota, JP;
Masahiko Mizutani, Ota, JP;
Sadamichi Takakusaki, Ota, JP;
Motoichi Nezu, Ora-gun, JP;
Kazutoshi Motegi, Ota, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
In preferred embodiments, a compact a hybrid integrated circuit devicecan be provided. A conductive patternis formed on the top surface of a circuit substrate, on the top surface of which an insulating layerhas been provided. Conductive patternis formed over the entirety of the top surface of the circuit substrate. Specifically, conductive patternis also formed at parts withinmm from the peripheral ends of circuit substrate. Also, a heat sinkA or other circuit elementwith some height can be positioned near a peripheral end part of circuit substrate. By arranging hybrid integrated circuit device, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.