The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Mar. 06, 2003
Hidehiro Sasaki, Tochigi-ken, JP;
Akinobu Hira, Kanuma, JP;
Keiichi Hashimoto, Utsunomiya, JP;
Hisao Tokoro, Utsunomiya, JP;
Hidehiro Sasaki, Tochigi-ken, JP;
Akinobu Hira, Kanuma, JP;
Keiichi Hashimoto, Utsunomiya, JP;
Hisao Tokoro, Utsunomiya, JP;
JSP Corporation, , JP;
Abstract
Expanded, substantially non-crosslinked polypropylene resin beads capable of producing a high rigidity foamed molding at a relatively low temperature. The beads are produced by a process including a step of dispersing substantially non-crosslinked polypropylene resin particles in a dispersing medium containing an organic peroxide to obtain a dispersion, a step of heating the dispersion to decompose the organic peroxide and to modify the surface of the surface-modified polypropylene resin particles, and a step of expanding the non-crosslinked, surface-modified polypropylene resin particles using a blowing agent.