The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Sep. 09, 2004
Kendra Gallup, Marina Del Rey, CA (US);
Brenton A. Baugh, Palo Alto, CA (US);
Robert E. Wilson, Palo Alto, CA (US);
James A. Matthews, Milpitas, CA (US);
James H. Williams, Walnut Creek, CA (US);
Kendra Gallup, Marina Del Rey, CA (US);
Brenton A. Baugh, Palo Alto, CA (US);
Robert E. Wilson, Palo Alto, CA (US);
James A. Matthews, Milpitas, CA (US);
James H. Williams, Walnut Creek, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.