The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2005

Filed:

Dec. 19, 2003
Applicants:

James E. Staargaard, Farmington Hills, MI (US);

Eric Kowal, Roseville, MI (US);

Thomas M. Goral, Oakland Township, MI (US);

Mitch Brown, Laingsburg, MI (US);

Keith R. Panter, Ann Arbor, MI (US);

Larry D. Butterfield, Canton, MI (US);

Blair Longhouse, Otterville, CA;

Jerry Klanges, Woodstock, CA;

Terry E. Nardone, Waterford, MI (US);

Dennis Gaida, Clarkston, MI (US);

Inventors:

James E. Staargaard, Farmington Hills, MI (US);

Eric Kowal, Roseville, MI (US);

Thomas M. Goral, Oakland Township, MI (US);

Mitch Brown, Laingsburg, MI (US);

Keith R. Panter, Ann Arbor, MI (US);

Larry D. Butterfield, Canton, MI (US);

Blair Longhouse, Otterville, CA;

Jerry Klanges, Woodstock, CA;

Terry E. Nardone, Waterford, MI (US);

Dennis Gaida, Clarkston, MI (US);

Assignees:

General Electric Company, Southfield, MI (US);

Carlisle Engineered Products, Inc., Livonia, MI (US);

Vari-Form, Woodstock, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60K011/04 ;
U.S. Cl.
CPC ...
Abstract

A front end module including a plastic component connected to a metallic substrate. The metallic substrate can be formed by hydroforming and shaped into a substantially unitary member. The plastic component is then molded about the metallic substrate and simultaneously forms connections thereto at discrete locations along the length of the metallic substrate.


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