The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Aug. 17, 2004
Yoshifumi Nakamura, Osaka, JP;
Ryuichi Sahara, Osaka, JP;
Nozomi Shimoishizaka, Kyoto, JP;
Kazuyuki Kainou, Osaka, JP;
Keiji Miki, Kyoto, JP;
Kazumi Watase, Kyoto, JP;
Yasutake Yaguchi, Osaka, JP;
Yoshifumi Nakamura, Osaka, JP;
Ryuichi Sahara, Osaka, JP;
Nozomi Shimoishizaka, Kyoto, JP;
Kazuyuki Kainou, Osaka, JP;
Keiji Miki, Kyoto, JP;
Kazumi Watase, Kyoto, JP;
Yasutake Yaguchi, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.