The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Jun. 01, 2001
Kenzo Hatada, Osaka, JP;
Kozo Sato, Chiba, JP;
Kenzo Hatada, Osaka, JP;
Kozo Sato, Chiba, JP;
Shindo Company, Ltd., Tokyo, JP;
Abstract
A semiconductor device comprising a laminate of plural insulating substratestoon which are mounted semiconductor chips (electronic parts), wherein, when the lower-most insulating substrate is regarded to be a first insulating substrateand other insulating substrates to be second insulating substratestoamong the insulating substrates that are laminated; second electrically conducting wiringstoare so provided as to protrude beyond the peripheral edges of the second insulating substrates and are folded toward the side of other surfaces of the second insulating substrates, and the thus folded second electrically conducting wirings are electrically connected to the electrically conducting wirings on the lower insulating substrates.