The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Sep. 19, 2003
Kendra J. Gallup, Marina del Rey, CA (US);
Frank S. Geefay, Cupertino, CA (US);
Ronald Shane Fazzio, Loveland, CO (US);
Martha Johnson, Greeley, CO (US);
Carrie Ann Guthrie, Fort Collins, CO (US);
Tanya Jegeris Snyder, Edna, MN (US);
Richard C. Ruby, Menlo Park, CA (US);
Kendra J. Gallup, Marina del Rey, CA (US);
Frank S. Geefay, Cupertino, CA (US);
Ronald Shane Fazzio, Loveland, CO (US);
Martha Johnson, Greeley, CO (US);
Carrie Ann Guthrie, Fort Collins, CO (US);
Tanya Jegeris Snyder, Edna, MN (US);
Richard C. Ruby, Menlo Park, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.