The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Jul. 24, 2003
Koji Numazaki, Nukata-gun, JP;
Mitsuhiro Saitou, Obu, JP;
Koji Numazaki, Nukata-gun, JP;
Mitsuhiro Saitou, Obu, JP;
Denso Corporation, Kariya, JP;
Abstract
A composite integrated circuit is formed by being molded with a mold resin, including a seat member of a lead frame, a substrate attached on the seat member of the lead frame, a heater element, and a temperature-restricted element. Here, the heater element and the temperature-restricted element are mounted on the substrate. The seat member of the lead frame includes a hollow member that is located under an intermediate area between the heater element and the temperature-restricted element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile