The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Dec. 21, 2001
Yoshiyuki Ishihama, Mie, JP;
Toshihiko Sugano, Mie, JP;
Masayuki Yamazaki, Kanagawa, JP;
Kou Obata, Kanagawa, JP;
Yoshiyuki Ishihama, Mie, JP;
Toshihiko Sugano, Mie, JP;
Masayuki Yamazaki, Kanagawa, JP;
Kou Obata, Kanagawa, JP;
Japan Polychem Corporation, Tokyo, JP;
Abstract
An ethylene polymer excellent in molding processability represented by uniform extensibility, drawdown resistance, swell and extrudability, and mechanical properties represented by rigidity, impact resistance and ESCR, is provided. Particularly, an ethylene polymer remarkably excelent in balance between rigidity and ESCR as compared with a conventionally known ethylene polymer is provided. An ethylene polymer, which is an ethylene homopolymer or a copolymer of ethylene with an α-olefin having a carbon number of from 3 to 20, and which satisfies the following conditions (1) to (4): (1) the melt index (HLMI) under a load of 21.6 kg at 190° C. is from 0.1 to 1000 g/10 min, (2) the density (d) is from 0.935 to 0.985 g/cm, (3) the relation between HLMI and d satisfies the following formula (i): d≧0.00900×log(HLMI)+0.951, (4) the relation between ESCR and the flexural modulus (M) satisfies the following formula (ii): M≧−7310×log(ESCR)+32300.