The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2005

Filed:

Dec. 16, 2003
Applicants:

Jae-eun Lim, Ichon-shi, KR;

Yong-sun Sohn, Ichon-shi, KR;

Inventors:

Jae-Eun Lim, Ichon-shi, KR;

Yong-Sun Sohn, Ichon-shi, KR;

Assignee:

Hynix Semiconductor Inc., Ichon-shi, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/76 ;
U.S. Cl.
CPC ...
Abstract

The method for manufacturing an STI in a semiconductor device with an enhanced gap-fill property and leakage property is disclosed by introducing a nitridation process instead of forming a liner nitride. The method includes steps of: preparing a semiconductor substrate obtained by a predetermined process on which a pad oxide and a pad nitride are formed on predetermined locations thereof; forming an isolation trench with a predetermined depth in the semiconductor substrate; forming a wall oxide on the trench; forming a liner oxide on the wall oxide and an exposed surface of the pad nitride; carrying out a nitridation process for forming a nitrided oxide; forming an insulating layer over the resultant structure, wherein the isolation trench is filled with the insulating layer; and planarizing a top face of the insulating layer.


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