The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Jun. 19, 2003
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.