The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Sep. 18, 2002
Shuhei Ishikawa, Handa, JP;
Tsutomu Mitsui, Chita-Gun, JP;
Ken Suzuki, Handa, JP;
Nobuaki Nakayama, Tokai, JP;
Hiroyuki Takeuchi, Handa, JP;
Seiji Yasui, Handa, JP;
Shuhei Ishikawa, Handa, JP;
Tsutomu Mitsui, Chita-Gun, JP;
Ken Suzuki, Handa, JP;
Nobuaki Nakayama, Tokai, JP;
Hiroyuki Takeuchi, Handa, JP;
Seiji Yasui, Handa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.