The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Oct. 18, 2001
Masaaki Iwane, Nara, JP;
Tetsuro Saito, Kanagawa, JP;
Tatsumi Shoji, Kanagawa, JP;
Makoto Iwakami, Kanagawa, JP;
Takehito Yoshino, Kyoto, JP;
Shoji Nishida, Nara, JP;
Noritaka Ukiyo, Nara, JP;
Masaki Mizutani, Nara, JP;
Masaaki Iwane, Nara, JP;
Tetsuro Saito, Kanagawa, JP;
Tatsumi Shoji, Kanagawa, JP;
Makoto Iwakami, Kanagawa, JP;
Takehito Yoshino, Kyoto, JP;
Shoji Nishida, Nara, JP;
Noritaka Ukiyo, Nara, JP;
Masaki Mizutani, Nara, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A wafer cassette comprises a holding member having a depression corresponding to the shape of the substrate, and a cover having an opening smaller than the surface size of the substrate. The substrate is to be held in the depression by means of the holding member and the cover, and the substrate is to be covered at its one-side surface, side and all peripheral region of the other-side surface, with the holding member at its depression and with the cover at the edge of its opening. Also disclosed are a liquid-phase growth system and a liquid-phase growth process which make use of the wafer cassette.